Adhesion-modified TPEs and TPUs for overmolded automotive applications
Recently we have seen a growing demand for high-quality applications that require the combination of soft and rigid substrates. The overmolding of soft TPEs and rigid plastics delivers genuine advantages for a product's functional, visual, acoustic and tactile properties. We invite you to learn more about our expertise in overmolding, adhesion testing, and our adhesion-modified thermoplastic elastomeric compounds.
In order to meet the broadest spectrum of application needs, Trinseo can offer a wide range of modified thermoplastic elastomeric compounds (TPE-S, TPE-O, TPE-U) all providing exceptional adhesion to the most common rigid plastic substrates, such as our MAGNUM™ ABS or PULSE™ PC/ABS grades.
Our modified TPEs can also be overmolded on polyamides (PA6, PA66, PA12), polyesters (PBT, PET), POM and other polar polymers such as SAN, ASA, PMMA, and polyolefins (PP and PE), including special blends and reinforced materials. Browse our gallery to see a a few examples selected from the wide range of possibilities for the combination our soft-touch and rigid materials.
Trinseo's TPEs and TPUs suitable for overmolded automotive applications:
TPU POLYMERS AND COMPOUNDS
VDI 2019 standard and our Specialized Overmolding Center (SOC)
At our manufacturing site in Mussolente, Italy, we established the Specialized Overmolding Center (SOC) for research. The SOC includes state‑of‑the‑art laboratory equipment, enabling our experts to measure the adhesion between soft and rigid components in accordance with the VDI 2019 standard. It allows us to determine the adhesion in relation to the main injection molding variables.
Our expertise and modified TPEs guarantee strong bonds without the use of primers, adhesion promoters or surface treatment. They offer features such as optimized emissions, excellent colorability and durability, with good UV and weathering resistance, and allow for improved aesthetics, high-quality haptics, and increased performance for automotive applications.